In mold manufacture of an object with embedded display panel

ABSTRACT

This invention relates to an object having a display panel embedded in its top surface and processes for its manufacture. The process comprises the steps of: forming an in-mold display transfer film or foil which comprises a temporary carrier layer, a release layer, a display panel, an adhesive layer and optionally a durable layer; feeding said in-mold display transfer film or foil into a mold with the temporary carrier film in contact with the inner surface of the mold; forming an object in the mold and transferring the in-mold display transfer film or foil onto the object; removing the object formed from the mold; and simultaneously removing both temporary carrier layer and release layer.

RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.10/860,992, filed Jun. 3, 2004; which claims the benefit of U.S.Provisional Application Ser. No. 60/476,852, filed Jun. 6, 2003. Thecontent of both applications are incorporated herein by reference intheir entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to an object having a display panel embedded inits top surface and processes for its manufacture.

2. Description of Related Art

Currently, for an object having a display panel, the object and thedisplay panel are manufactured separately and the two components arethen assembled together. The assembly of such an object usually requiresmechanical integration or lamination, which typically results in a largegap between the object and the display and also an increase in the totalthickness or volume of the object. Therefore, the current methods cannotmeet certain product requirements such as style, compactness anddurability, which features are especially important for handhelddevices.

SUMMARY OF THE INVENTION

The first aspect of the invention is directed to an object having adisplay panel embedded in its top surface. There may also be decorativedesigns (e.g., text or graphic) appearing on the top surface.

The second aspect of the invention is directed to an in-mold displaytransfer film or foil.

The third aspect of the present invention is directed to an in-molddisplay insertion film or foil. In this aspect of the invention, adisplay panel may be formed on a carrier film comprising an electrodelayer.

The display panel in the in-mold display transfer film or foil or in thein-mold display insertion film or foil may be any plastic-based displayssuch as polymer dispersed liquid crystal displays (PDLCs), cholestericliquid crystal displays (ChLCD), organic light emitting devices (OLEDs),electrophoretic displays (EPDs) or other particle based displays.

The fourth aspect of the invention is directed to processes for themanufacture of an object of the first aspect of the invention.

The present invention has a wide variety of applications. For example,the object may be a plastic cover of a cell phone or pager and thedisplay panel embedded in the top surface may display text messages,time and dates and/or colored or flashing signals alerting the user toincoming phone calls or number of voice mail messages. In fact, theinvention is useful for any objects which are made of a plasticmaterial, such as personal accessories (e.g., handbags or wallets), toysor educational devices, plastic cover of a personal digital assistant ore-book, credit or smart cards, identification or business cards, theface of an album, watch, clock, radio or camera, the dashboard in anautomobile, household items (e.g., cups, dishes or bottles), laptopcomputer housings and carrying cases or front control panels of anyconsumer electronic equipments. This list is clearly not exhaustive.Other applications would be clear to a person skilled in the art andtherefore they are all encompassed within the scope of the presentinvention.

When a plastic display is embedded in an object, the seamlessintegration produces a very appealing look. The display panel mayconform to the object surface, even if the surface is curved. As aresult, the display panel may appear as one integral or printed part ofthe object. According to the present invention, large size plasticdisplays may also be embedded in an object, which would be impossible toachieve with traditional display assembly technology.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiments of the invention are disclosed in the followingdetailed description and the accompanying drawings.

FIG. 1 shows the top view of an object of the present invention.

FIG. 2 a is a cross-section view of an in-mold transfer film or foilcomprising a display panel.

FIG. 2 b is a cross-section view of an in-mold insertion film or foilcomprising a display panel.

FIG. 2 c is an enlarged view of a typical plastic-based display panel.

FIG. 3 a is the cross-section view of an injection molding processinvolving an in-mold transfer film or foil.

FIG. 3 b is the cross-section view of an injection molding processinvolving an in-mold insertion film or foil.

FIGS. 4 a and 4 b illustrate an object of the present invention havingan inner cavity.

FIGS. 5 and 6 illustrate application of decorative designs to an objectof the present invention.

DETAILED DESCRIPTION

The invention can be implemented in numerous ways, including as aprocess, an apparatus, a system, a composition of matter, a computerreadable medium such as a computer readable storage medium or a computernetwork wherein program instructions are sent over optical or electroniccommunication links. In this specification, these implementations, orany other form that the invention may take, may be referred to astechniques. In general, the order of the steps of disclosed processesmay be altered within the scope of the invention.

A detailed description of one or more embodiments of the invention isprovided below along with accompanying figures that illustrate theprinciples of the invention. The invention is described in connectionwith such embodiments, but the invention is not limited to anyembodiment. The scope of the invention is limited only by the claims andthe invention encompasses numerous alternatives, modifications andequivalents. Numerous specific details are set forth in the followingdescription in order to provide a thorough understanding of theinvention. These details are provided for the purpose of example and theinvention may be practiced according to the claims without some or allof these specific details. For the purpose of clarity, technicalmaterial that is known in the technical fields related to the inventionhas not been described in detail so that the invention is notunnecessarily obscured.

FIG. 1 shows the top view of an object (10) comprising a display panel(11) embedded in its top surface. Text or graphic design (12) may alsooptionally appear on the top surface. The term “embedded”, in thecontext of the present invention, is intended to indicate that thedisplay panel is integrated into the top surface of the object when theobject is being formed, not after the object is formed.

The manufacturing process suitable for the formation of the object mayinclude, for example, hot stamping, lamination, injection molding,thermoforming, compression molding or blow molding. Examples of thematerial suitable for the object in the stamping, lamination or moldingprocess may include, but are not limited to, thermoplastic materialssuch as polystyrene, polyvinyl chloride, acrylics, polysulfone,polyarylester, polypropylene oxide, polyolefins,acrylonitrile-butadiene-styrene copolymers (ABS),methacrylate-acrylonitrile-butadiene-styrene copolymers (MABS),polycarbonate, polybutylene terephthalate (PBT), polyethyleneterephthalate (PET), polyurethanes and other thermoplastic elastomers orblends thereof, and thermoset materials such as reaction injectionmolding grade polyurethanes, epoxy resin, unsaturated polyesters,vinylesters or composites, prepregs and blends thereof.

(I) In-Mold Display Transfer Films or Foils

In the manufacture of the object of the present invention, an in-molddisplay transfer film or foil comprising a display panel is firstprepared.

Although the term “in-mold” is used throughout this application, it isunderstood that the present invention can be extended to processes suchas stamping, lamination or a combination of stamping or lamination and amolding process.

FIG. 2 a is a cross-section view of such an in-mold display transferfilm or foil (20) which comprises a temporary carrier layer (21), arelease coating (22), an optional durable coating (23), a display panel(24) and an adhesive or tie-coat layer (25). The release layer (22), thedurable layer (23) if present, the display panel (24) and the adhesivelayer (25) are sequentially coated or laminated onto the carrier film(21) and these different layers are collectively referred to as the“in-mold display transfer film or foil” throughout this application forease of illustration.

In the in-mold transfer process, the in-mold display transfer film orfoil is fed into the mold with the temporary carrier layer (21) incontact with the mold surface.

The key element, the display panel (24) may be a particle-based displaysuch as a flipping ball display as described in T. Pham, et al, SID 02Digest, p. 119 (2002); a liquid powder display as described in R.Hattori, et al, SID 03 Digest, p. 846 (2003); or an electrophoreticdisplay, particularly a Microcup.RTM. EPD as disclosed in co-pendingapplications, U.S. Ser. No. 09/518,488 (corresponding toPCT/US01/06917), U.S. Ser. No. 09/879,408 (corresponding toWO02/100155), U.S. Ser. No. 10/447,719 (corresponding to WO03/102673),U.S. Ser. No. 10/422,413 (corresponding to WO03/91798), U.S. Ser. No.10/422,557 (corresponding to WO03/91788) and U.S. Ser. No. 60/375,936,the contents of all of which cited above are incorporated herein byreference.

The electrophoretic display may have a traditional up/down switchingmode. It may have an in-plane or a dual switching mode as disclosed inco-pending applications, U.S. Ser. No. 10/198,729 (corresponding toWO03/009059) and U.S. Ser. No. 10/222,036 (corresponding to WO03/016993)respectively, the contents of both are incorporated herein by reference.

The display panel may also be an OLED (organic light emitting device), aPLED (polymer light emitting device) or a liquid crystal display,particularly a polymer dispersed liquid crystal (PDLC), Microcup.RTM.LCD [as disclosed in co-pending applications, U.S. Ser. No. 09/759,212(corresponding to WO02/56097) and U.S. Ser. No. 10/178,990, the contentsof both are incorporated herein by reference] or a cholesteric liquidcrystal device (ChLCD). Reviews of reflective displays including PDLCand OLED/PLED can be found in the books, P. S. Drzaic, “Liquid CrystalDispersions”, World Scientific Publishing Co. (1995); S-T. Wu and D-K,Yang “Reflective Liquid Crystal Displays”, John Wiley & Sons, (2001);and R. Hattori, et al, SID 03 Digest, p. 846 (2003), respectively, thecontents of all of which are also incorporated herein by reference.

The display panel is preferably thin and flexible and the substrate usedfor the formation of the display panel preferably has a high heatdistortion temperature to allow the display to withstand the processconditions in the transferring process, such as injection molding orother molding conditions. A plastic based display panel is preferred.The term “a plastic-based display panel”, in the context of the presentinvention, refers to a display panel which is formed on a plasticsubstrate layer, sandwiched between two plastic substrate layers orsandwiched between a transparent plastic layer and an insulator-coatedthin metal or metal oxide foil or a glass sheet. The metal or metaloxide foil may be formed from steel such as carbon steel or stainlesssteel, Al, Sn, Ni, Cu, Zn, Mg or alloys, oxides, composites or blendsthereof.

FIG. 2 c is an enlarged view of a plastic-based Microcup.RTM. displaypanel. The panel (24) has a plurality of display cells (26), a topelectrode plate (27 a) and a bottom electrode plate (27 b). The displaypanel may be formed on a bottom plastic substrate layer (28 b),laminated with a top plastic substrate layer (28 a) or both. Suitablematerials for the plastic substrate layer(s) may include polyethyleneterephthalate (PET), polybutylene terephthalate (PBT), polyethylenenaphthalate (PEN), polyolefins including polycyclic olefins,polycarbonate (PC), polymethyl methacrylate (PMMA), polysulfone,polyimide (PI), polyarylester, polystyrene, polyurethane, polysiloxaneand copolymers, blends or composites thereof, with PET, PBT, PEN and PCas preferred.

In a Microcup.RTM.-based display, the display cells (26) areindividually top-sealed with a sealing layer formed from a materialselected from the group consisting of thermoplastics, thermoplasticelastomers, thermosets and precursors thereof.

For the display panel, either the side of the top electrode layer (27 a)or the side of the bottom electrode layer (27 b) may be the viewingside. In other words, in the in-mold display transfer film or foil,either the side of the top electrode layer or the side of the bottomelectrode layer may be in contact with the release layer (22) or thedurable layer (23), if present, in the molding process.

In the case of in-plane switching EPD which comprises an in-planeelectrode substrate and an insulator substrate, the viewing side ispreferably the insulator side to simplify the connection to the displaydriver and outside circuitries.

The temporary carrier layer (21) usually is a thin plastic film with athickness from about 3.5 to about 50 microns. PET, PEN and PC films areparticularly preferred because of their low cost, high transparency andthermomechanical stability.

The release coating (22) of the in-mold transfer display film allows thedisplay panel coating to release from the carrier in a manner thatminimizes damage to the display panel and enables a fully automated rolltransfer process during molding.

The release coating usually is a low surface tension coating preparedfrom a material such as wax, paraffin, silicone, or a highly smooth andimpermeable coating prepared from a material such as radiation curablemultifunctional acrylates, silicone acrylates, epoxides, vinyl esters,vinyl ethers, allyls unsaturated polyesters, vinyl unsaturatedpolyesters, or blends thereof. The release layer may comprise acondensation polymer, copolymer, blend or composite selected from thegroup consisting of epoxy, polyurethane, polyimide, polyamide, melamineformaldehyde, urea formaldehyde and phenol formaldehyde.

The optional durable coating (23) serves as a protective layer to thedisplay panel (24) and the ink or metal patterns, if present. Suitableraw materials for the durable coating may include, but are not limitedto, radiation curable multifunctional acrylates including epoxyacrylates, polyurethane acrylates, polyester acrylates, siliconeacrylates, glycidyl acrylates, epoxides, vinyl esters, diallylphthalate, vinyl ethers and blends thereof. The optional durable coatingmay comprise a condensation polymer or copolymer, such as epoxy,polyurethane, polyamide, polyimide, melamine formaldehyde, ureaformaldehyde or phenol formaldehyde. The optional durable coating maycomprise a sol-gel silicate or titanium ester.

The durable layer of the in-mold transfer display film may be partiallyor fully cured. If partially cured, a post curing step will be employedafter the molding and/or transferring step to enhance the durability,particularly hardness, scratch and oil resistance.

To improve the release properties, the raw material, particularly thelow molecular weight components of the durable layer is preferably notpermeable into the release layer. After the durable layer is coated andcured or partially cured, it should be marginally compatible orincompatible with the release layer. Binders and additives such asthickeners, surfactants, dispersants, UV stabilizers or antioxidants maybe used to control the rheology, wettability, coating properties,weatherability and aging properties. Fillers such as silica,Al.sub.2O.sub.3, TiO.sub.2, CaCO.sub.3, microcrystalline wax orpolyethylene, Teflon or other lubricating particles may also be added toimprove, for example, scratch resistance and hardness of the durablelayer. The durable layer is usually about 2 to about 20 microns,preferably about 3 to about 8 microns in thickness. The durable layer inthe areas covering the display panel is preferably transparent.

When the durable layer (23) is not present, the top substrate layer (28a) or the bottom substrate layer (28 b) in the display panel (24) mayserve as a protective layer. In this case, the display substrate layeron the viewing side may extend beyond the display panel area and coverspart or all of the release film of the transfer film or foil. Thedisplay panel (24) may be laminated directly onto the release layer orthe durable layer, if present, optionally with an adhesive (not shown).

The adhesive layer (25) is incorporated into the display panel coatingto provide optimum adhesion of the display panel (24) and the ink ormetal patterns, if present, to the top surface of the molded object. Theadhesive layer may be formed from a material such as polyacrylate,polymethacrylate, polystyrene, polycarbonate, polyurethane, polyester,polyamide, epoxy resin, ethylene vinylacetate copolymers (EVA),thermoplastic elastomers or the like, or copolymers, blends orcomposites thereof. Hot melt or heat activated adhesives such aspolyurethane and polyamide are particularly preferred. The thickness ofthe adhesive layer may be in the range of about 1 to about 20 microns,preferably in the range of about 2 to about 6 microns.

If a durable layer is present, printed ink or metal patterns may bepresent between the display panel (24) and the durable layer (23) orbetween the durable layer (23) and the adhesive layer (25) in the areasthat no display is present. If the durable layer is not present, theprinted ink or metal patterns may be present on the display panel asillustrated in Section IV below.

(II) In-Mold Display Insertion Films or Foils

FIG. 2 b is a schematic cross-section view of an in-mold displayinsertion film or foil. In this case, the carrier layer (21 a) willbecome part of the finished product after the stamping, lamination or amolding process. The display panel (24) may be laminated onto thecarrier film (21 a) with an adhesive layer (not shown) and optionallyover-coated on the other side with a hot melt or heat activated adhesive(25). Alternatively, the display panel may be prepared directly on thecarrier film by methods known in the art, for example, the methods asdescribed in co-pending application, U.S. Ser. No. 09/518,488. In thiscase, the carrier film may comprise a transparent electrode layer suchas indium-tin oxide (ITO).

Similar to the in-mold display transfer film or foil, printed ink andmetal patterns may be present between the display panel and the carrierfilm or between the carrier film and the adhesive layer (25) in theareas that no display is present. These different layers arecollectively referred to as the “in-mold display insertion film or foil”throughout this application for ease of illustration.

(III) Manufacture of the Object

A typical in-mold transfer process is illustrated in FIG. 3 a. In themolding process, the in-mold display transfer film or foil is on a rollor web continuously fed into a molding machine. The mold (30) may be aninjection or compression mold for the object (36 b). During the moldingprocess, the mold is closed and the plastic melt for the formation ofthe object is injected into the mold cavity (36 a) through injectionnozzles and runners. After molding, the display panel, the durable layerif present, and also the ink and metal decoration patterns, if present,are transferred onto the molded object. The molded object is removedfrom the mold. The temporary carrier layer (31) and the release layer(32) are also simultaneously removed leaving the durable coating (33),if present, to be the top-most layer on the surface of the object withthe display panel (34) embedded underneath as an integral part of theobject. The layer (35) is an adhesive layer.

To facilitate the registration of the display transfer film to the mold,the roll or web may be pre-printed with registration marks andcontinuously fed into the mold with registration by, for example, anoptical sensor.

When the durable layer (33) is not present, one of the plastic substratelayers of the display panel (34) would be the top-most layer on thesurface of the object.

In an in-mold insertion process as illustrated in FIG. 3 b, an in-molddisplay insertion film or foil is first cut into an appropriate size andshape and then inserted into a mold (30). The in-mold display insertionfilm is placed against the mold wall as shown, optionally under vacuum.The display panel coating can be placed manually, an electrostaticcharge may be used to facilitate its insertion or the insertion may bemechanized. Mechanized insertion is advantageous especially for largevolume production.

The carrier layer (31 a) of the display insertion film is in contactwith the inner wall surface of the mold. The mold is then closed and theplastic melt for the formation of the object (36 b) is injected into themold cavity (36 a) through injection nozzles and runners. The carrierfilm (31 a) in this case may become an integrated part of the finishedproduct. Optionally, the display insertion film may be thermoformed to acertain shape and die cut before being inserted into the mold.

The mold used for either of the two types of manufacturing process mustbe designed with the display panel insertion or transfer in mind. Gatelocations must allow the display panel to be pressed up against the moldcavity to assure adequate thermal transfer through the various layers inthe display panel. Also, the mold must be so designed that theelectrodes of the display panel after the molding process may be exposedfor subsequent connection to display driver and outside circuitries. Inaddition, mold flow and filling analysis should be performed prior tocutting of the mold material. A mold cooling analysis should also beconsidered to minimize mold hot spots. Finally the mold temperaturesettings must take into account the presence of the display panel.

The connectors which connect the display panel to outside circuit anddriver are not shown in either FIG. 2 a or FIG. 2 b. The in-mold displaytransfer film or foil or the in-mold display insertion film or foil maybe in the form of a roll.

FIG. 4 a is a cross-section view of a solid object with a display panelembedded in its top surface. The object (40) may have connection cavityin the form of open holes or slots (41) in the body as shown to allowconnection of the display panel (42) to the required circuitries. Theelectrodes (43) of the display are routed and exposed through the holesor slots for driver connection. A flex cable (44), or other types offlexible connection harness, can be attached to the electrodes by eitherconductive adhesive (45), such as ACF, conductive PSA or silver paste,or mechanical clamping.

FIG. 4 b illustrates a snap-in plug (46) that can be further inserted tosecure the bonding area and enhance the reliability of the electrodeconnection. For a direct drive display, the common electrode ispositioned on the viewing side, which is applied on the carrier film inthe case of in-mold display insertion film or foil. The segmentelectrodes of the direct drive display are routed through vias (throughholes) to the connection pads, which are positioned on the rear surfaceof the display. For an active matrix display, the common electrode ispositioned on the viewing side and the flexible active switchingcomponent layer is positioned at the non-viewing side. Signal connectionpads are located on the rear surface of the display and connected to theactive switching components through vias. For a passive matrix display,all row electrodes and column electrodes should be routed to the rearsurface to ease the connection process. The routing can be achievedthrough vias or flexible circuit adaptors. In the three types ofdisplay, namely, direct drive, active matrix and passive matrix, thedisplay drivers (47) can be optionally installed on the display toreduce the number of connection pads, which can further improveconnection quality and reduce manufacturing cost.

Alternatively, the object may be formed by blow molding or thermoformingto create an inner cavity to accommodate the circuitries. Formanufacturing an object by blow molding or thermoforming, the displaytransfer or insertion film is first placed into an open mold and held inplace by, for example, vacuum or tension; the mold is then closed. Theplastic material for forming the object is thermoformed or blown intothe mold. The display panel, like in the injection or compressionmolding process, is adhered to and embedded in the top surface of themolded object such as a cup or bottle.

Alternatively the object may be formed by other molding processes suchas compression molding, hot stamping or lamination.

(IV) Application of Decorative Designs

Text and/or graphic designs may also appear on the top surface of theobject. The most common designs include brand names, logos or symbols orother decorative designs.

Traditional methods for adding decorative designs have included screenprinting, pad printing, hot stamping, lamination and painting. Thesemethods historically have been post-molding operations that requireadditional processing steps.

In recent years, alternative decoration methods, such as in-mold foil,insert molding or sublimation heat transfer has been used. FIGS. 5 and 6illustrate the in-mold decoration processes.

FIG. 5 is an enlarged view of a display panel in an in-mold displaytransfer or insertion film. The display panel comprises a plurality ofdisplay cells (50), a top electrode layer (51), a bottom electrode layer(52) and a top plastic substrate layer (53). The decorative designs maybe screen printed on the first surface (54) or the second surface (55,the back side) of the top plastic substrate layer. The bottom electrodelayer (52) is disposed on a bottom substrate layer (57) which may bebonded to the plastic molded object (not shown) with an adhesive or atie layer (not shown). The bottom substrate layer may be a plastic layeras described above or an insulator-coated metal or metal oxide foilformed from carbon steel, stainless steel, Al, Sn, Ni, Cu, Zn, Mg or analloy or oxide thereof.

FIG. 6 shows an alternative in which the decorative designs are printedon the first surface (64) of the top plastic substrate layer (63) whichis underneath the top durable layer (66) or on the second surface (65)of the top substrate layer (63) which is above the first electrode layer(61) of the display. If the decoration pattern is on the first surface(64), a durable layer (66) above is highly desirable to improve thehardness, scratch and oil resistance of the surface. Similar to thein-mold display film described in FIG. 5, the bottom electrode layer(62) is disposed on a bottom substrate layer (67) which may be bonded tothe plastic molded object (not shown) with an adhesive or a tie layer(not shown). The bottom substrate layer may be a plastic layer asdescribed above or an insulator-coated metal or metal oxide foil formedfrom carbon steel, stainless steel, Al, Sn, Ni, Cu, Zn, Mg or an alloyor oxide thereof.

The decorative designs may also be formed by thermoforming. In thiscase, the carrier film will become part of the molded object and thetotal decorative layer having raised or recessed patterns is typicallyin the range of about 0.2 to about 1 mm, preferably in the range ofabout 0.3 to about 0.7 mm in thickness. It is usually thermoformed froman ABS, polystyrene or PVC sheet in a mold.

Alternatively, the decorative layer may be also formed by high pressureforming involving the use of high-pressure air to create decorativedesigns on a film. The decorative layer may also be formed byhydroforming in which a hydrostatic bladder, rather than air, serves asthe forming mechanism.

It should also be noted that the decorative layer prepared from eitherone of the methods described above must have the decorative designsstrategically printed in areas which do not overlap with the displaypanel. In other words, the decorative designs should not interfere withthe display image.

While the present invention has been described with reference to thespecific embodiments thereof, it is understood that various changes maybe made and equivalents may be substituted without departing from thetrue spirit and scope of the invention. In addition, many modificationsmay be made to adapt to a particular situation. All such modificationsare intended to be within the scope of the present invention.

Although the foregoing embodiments have been described in some detailfor purposes of clarity of understanding, the invention is not limitedto the details provided. There are many alternative ways of implementingthe invention. The disclosed embodiments are illustrative and notrestrictive.

1. A process for manufacturing an object having a display panel embeddedin its top surface, comprising: a) forming an in-mold display transferfilm or foil which comprises a temporary carrier layer, a release layer,a display panel, an adhesive layer and optionally a durable layer; b)feeding said in-mold display transfer film or foil into a mold with thetemporary carrier film in contact with the inner surface of the mold; c)forming an object in the mold and transferring the in-mold displaytransfer film or foil onto the object; d) removing the object formedfrom the mold; and e) simultaneously removing both temporary carrierlayer and release layer.
 2. The process of claim 1, wherein the objectis formed by injecting a melted plastic material into the mold.
 3. Theprocess of claim 1, wherein the object is formed by thermoforming orblow molding a plastic material in the mold.
 4. The process of claim 1,wherein the object is formed by compression forming a plastic materialin the mold.
 5. The process of claim 1, wherein said display panel is anelectrophoretic display.
 6. The process of claim 1, wherein said displaypanel is a liquid crystal display.
 7. The process of claim 1, whereinsaid temporary carrier layer is a thin film of PET, PEN or PC.
 8. Theprocess of claim 1, wherein said release layer is formed from a materialor a blend thereof selected from the group consisting of wax, paraffin,silicone, and a coating prepared from a radiation curablemultifunctional acrylate, silicone acrylate, epoxide, vinyl ester, vinylether, allyl unsaturated polyester, or vinyl unsaturated polyester. 9.The process of claim 1, wherein said release layer comprises acondensation polymer, copolymer, blend or composite selected from thegroup consisting of epoxy resin, polyurethane, polyimide, polyamide,melamine formaldehyde, urea formaldehyde and phenol formaldehyde. 10.The process of claim 1, wherein said optional durable layer is formedfrom a radiation curable multifunctional acrylate, epoxide, vinyl ester,diallyl phthalate, vinyl ether, or a blend thereof.
 11. The process ofclaim 10, wherein said radiation curable multifunctional acrylate isepoxy acrylate, polyurethane acrylate, polyester acrylate, siliconeacrylate, or glycidyl acrylate.
 12. The process of claim 1, wherein saidoptional durable layer comprises a condensation polymer or copolymer.13. The process of claim 12, wherein said condensation polymer orcopolymer is selected from the group consisting of epoxy resin,polyurethane, polyamide, polyimide, melamine formaldehyde, ureaformaldehyde and phenol formaldehyde.
 14. The process of claim 1,wherein said optional durable layer comprises a sol-gel silicate ortitanium ester.
 15. The process of claim 1, wherein said adhesive layeris formed from polyacrylate, polymethacrylate, polystyrene,polycarbonate, polyurethane, polyester, polyamide, epoxy resin, aethylene vinylacetate copolymer, a thermoplastic elastomer, or acopolymer, blend or composite thereof.
 16. The process of claim 1,wherein said adhesive layer is a hot melt or heat activated adhesive.17. The process of claim 1, wherein said adhesive layer is polyurethane,polyamide or a copolymer, blend or composite thereof.
 18. The process ofclaim 1, wherein said adhesive layer is polycarbonate, polyacrylate,polymethacrylate or a copolymer, blend or composite thereof.
 19. Aprocess for manufacturing an object having a display panel embedded inits top surface, comprising: a) forming an in-mold display insertionfilm or foil which comprises a carrier layer, a display panel and anadhesive layer; b) inserting said in-mold display insertion film or foilinto a mold with said carrier layer in contact with the inner surface ofthe mold; c) forming an object in the mold and transferring the in-molddisplay insertion film or foil onto the object; and d) removing theformed object from the mold.
 20. The process of claim 19, wherein saiddisplay panel is formed directly on the carrier layer.
 21. The processof claim 19, wherein the object is formed by injecting a melted plasticmaterial into the mold.
 22. The process of claim 19, wherein the objectis formed by thermoforming or blow molding a plastic material in themold.
 23. The process of claim 19, wherein the object is formed bycompression forming a plastic material in the mold.
 24. The process ofclaim 19, wherein said display panel is an electrophoretic display. 25.The process of claim 19, wherein said display panel is a liquid crystaldisplay.